Solidigm •
New

NAND Product Development Engineer

Minhang District, cn, China Full-time 5+ yrs
  • Develop burn-in and high speed I/O test plans, procedures, and validation methodologies for NAND flash memory components Lead the execution of electrical testing of NAND components to validate functionality, performance, and reliability.
  • Analyze test data to identify trends, anomalies, and areas for improvement in product design or manufacturing processes.
  • Optimize test methodologies to improve test coverage, efficiency, and cycle time. Provide technical expertise and support for yield enhancement and failure analysis activities.
  • Collaborate with design, process, and reliability engineering teams to troubleshoot and resolve complex test failures.
  • Work close with SSD engineering teams, to ensure the integration of the NAND into the SSD through component/system co-optimization.
  • Master's degree in Electrical/Electronic Engineering, Computer Engineering, Semiconductor Circuit, or related fields.
  • 5+ years of experience in logic/memory product engineering or test engineering.
  • Proficient in statistical data analysis and electrical failure analysis to segment and determine root cause of test failures.
  • Knowledge of burn-in and high speed I/0 test platforms and architecture.
  • Knowledge of NAND Flash memory technology, including architecture and operation

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